To provide a Cu-Ni-Si-based copper alloy sheet having excellent deep drawability and fatigue resistance capable of use under high temperature and high vibration environment over a long period of time in a predetermined shape as a material of various electronic parts.
The Cu-Ni-Si-based copper alloy sheet contains 1.0-3.0 mass% of Ni, wherein the concentration of Si is 1/6 to 1/4 of that of Ni mass%, and the remainder includes Cu and inevitable impurities. The Cu-Ni-Si-based copper alloy sheet has Goss orientation density, which is measured by EBSD method using a scanning electron microscope with an electron backscatter diffraction pattern system, of 2.0-6.0%, an average value of KAM (kernel average misorientation) of 0.9-1.5°, and a ratio (Lσ/L) of the total special grain boundary length Lσ of special grain boundaries to the total grain boundary length L of crystal grain boundaries of 60-70%.
ABE YOSHIO
SAITO AKIRA
KAMEYAMA YOSHIHIRO
| JP2009263784A | 2009-11-12 | |||
| JP2008075172A | 2008-04-03 | |||
| JP2007291458A | 2007-11-08 | |||
| JP2008095185A | 2008-04-24 | |||
| JP2007119844A | 2007-05-17 | |||
| JP2007039789A | 2007-02-15 | |||
| JP2011162848A | 2011-08-25 | |||
| JP2009263784A | 2009-11-12 | |||
| JP2008075172A | 2008-04-03 | |||
| JP2007291458A | 2007-11-08 | |||
| JP2008095185A | 2008-04-24 | |||
| JP2007119844A | 2007-05-17 | |||
| JP2007039789A | 2007-02-15 | |||
| JP2011162848A | 2011-08-25 |