Ｃｕ基合金粉末 - Sanyo Special Steel Co., Ltd.

Title:

Ｃｕ基合金粉末

Document Type and Number:

Japanese Patent JP7425634

Kind Code:

B2

Abstract:

To provide Cu-based alloy powder suitable for a laminate molding method.SOLUTION: The Cu-based alloy powder is composed of a large number of particles. The material of each particle is a Cu based alloy containing Cu and one or two types selected from the group consisting of Cr and Nd, Gd, Dy and Y. The content of Cr in the Cu based alloy is 0.10% mass% or larger and 1.00 mass% or smaller, and the total content of Nd, Gd, Dy and Y is 0.10 mass% or larger and 5.00 mass% or smaller. Preferably, the Cu-based alloy further comprises Si of 0.0 mass% to 0.20 mass%, P of 0.0 mass% or larger to 0.10 mass% or smaller and S of 0.0 mass% or larger and 0.10 mass% or smaller, and the remainder is inevitable impurities. The preferred oxygen content is 1000 ppm or smaller.SELECTED DRAWING: None

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Inventors:

Yuka Nishimen
Yoshikazu Aikawa
Toshiyuki Sawada

Application Number:

JP2020042644A

Publication Date:

January 31, 2024

Filing Date:

March 12, 2020

Export Citation:

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