Title:
高分子電解質接着用、又は高分子電解質シール用硬化型組成物
Document Type and Number:
Japanese Patent JP7235037
Kind Code:
B2
Abstract:
[Object] To provide a curable composition for a polymer electrolyte, which enables a polymer electrolyte to strongly adhere to another substrate such as a heat-resistant polymer in a short time, and is excellent in terms of reliability (in particular, no peeling even in immersion in hot water) in its adhesion state, as well as to provide a layered body.[Solution] A curable composition for a polymer electrolyte, including: a component (A): a radical polymerizable compound having a (meth)acryloyl group, a component (B): a compound having, in one molecule, an epoxy group and a skeleton of at least one selected from the group consisting of polybutadiene, polyisoprene, hydrogenated polybutadiene, and hydrogenated polyisoprene, and a component (C): a radical polymerization initiator, in which a content of each of the components (A) to (C) based on the entire composition is as follows,the component (A): from 30 to 98.9% by massthe component (B): from 1 to 40% by mass, andthe component (C): from 0.1 to 15% by mass.
Inventors:
Kazumasa Inada
Application Number:
JP2020505092A
Publication Date:
March 08, 2023
Filing Date:
March 06, 2019
Export Citation:
Assignee:
Toagosei Co., Ltd.
International Classes:
C09J175/14; B32B27/00; B32B27/16; B32B27/20; B32B27/30; C08F290/06; C09J163/08; H01M8/0284; H01M8/10
Domestic Patent References:
| JP2011021173A | ||||
| JP2017219565A | ||||
| JP2001207033A | ||||
| JP2004176014A |