To provide a curable resin composition capable of giving a cured material, etc., having a high hardness of coated film after the curing, a coating hardly having scratches and a small warpage after the curing, and the cured material of the same.

This curable resin composition comprises a vinyl-based polymer expressed by formula (1) [wherein, R1 is a 2-8C alkylene; R2 is H or methyl: and (m) and (n) are each independently a positive integer], wherein the vinyl-based polymer has a molecular weight distribution (Mw/Mn) of the weight-average molecular weight (Mw) to the number-average molecular weight (Mn) in the range of 1.00-1.80. The cured material is obtained by curing the composition or a material containing the composition.