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Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PRINTED WIRING BOARD, AND NAPHTHOL RESIN
Document Type and Number:
Japanese Patent JP2012201798
Kind Code:
A
Abstract:

To provide a naphthol resin having slightly-changed heat resistance after subjected to a thermal history and exhibiting low thermal expandability, and further realizing excellent solvent solubility.

The naphthol resin contains 15-35% of a trimer, which is a polycondensate of an α-naphthol compound, a β-naphthol compound and formaldehyde and is shown by formula (1) (wherein R1 and R2 are each a hydrogen atom, a 1C-4C hydrocarbon group or a 1C-4C alkoxy group independently), and 1-25% of a dimer of the polycondensate.


Inventors:
SATO YASUSHI
Application Number:
JP2011067730A
Publication Date:
October 22, 2012
Filing Date:
March 25, 2011
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C08G8/24; C08G59/62; C08K5/13; C08L61/12; C08L63/00; H05K1/03
Attorney, Agent or Firm:
Kono Tsuyo