Title:
硬化性樹脂組成物、硬化物、ドライフィルム、フィルム、プリプレグ、金属張積層板、プリント配線基板および電子機器
Document Type and Number:
Japanese Patent JP6829029
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition which makes it possible to obtain a cured product that satisfies dielectric properties in a high frequency region suitable for a printed wiring board while having excellent heat resistance and heat stability.SOLUTION: A curable resin composition comprises epoxy resin (A), and a cyclic olefin (co) polymer (B). The ratio between a content of the epoxy resin (A) to a content of the cyclic olefin (co) polymer (B) in the curable resin composition, ((A)/(B)), is more than 5 and 50 or less.SELECTED DRAWING: None
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Inventors:
Hirohiko Murase
Atsushi Morita
Takashi Oikawa
Junji Saito
Atsushi Morita
Takashi Oikawa
Junji Saito
Application Number:
JP2016169378A
Publication Date:
February 10, 2021
Filing Date:
August 31, 2016
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08L63/00; B32B15/08; B32B15/085; B32B15/092; C08F232/00; C08J5/24; C08L45/00; H05K1/03
Domestic Patent References:
| JP2006096873A | ||||
| JP2016017089A |
Foreign References:
| WO2013146647A1 |
Attorney, Agent or Firm:
Shinji Hayami