Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2021156951
Kind Code:
A
Abstract:
To provide: a curable resin composition which exhibits excellent developing performance and can form a cured product having excellent chemical resistance; a dry film having a resin layer obtained from the composition; a cured product of the composition or of the resin layer of the dry film; and an electronic component having the cured product.SOLUTION: A curable resin composition and the like comprise a carboxyl group-containing resin (A), a photopolymerization initiator (B), an epoxy resin (C), and a silica (D), wherein: the curable resin composition does not comprise a silica having a particle size of more than 300 nm as the silica; and a ratio of (an epoxy group in the epoxy resin (C))/(a carboxyl group in the carboxyl group-containing resin (A)) is 1.9-2.9.SELECTED DRAWING: None
Inventors:
SHIBATA DAISUKE
FUNAKOSHI CHIHIRO
FUNAKOSHI CHIHIRO
Application Number:
JP2020054585A
Publication Date:
October 07, 2021
Filing Date:
March 25, 2020
Export Citation:
Assignee:
TAIYO INK MFG CO LTD
International Classes:
G03F7/038; C08F299/00; C08G59/42; G03F7/004; G03F7/032; H05K1/03; H05K3/46
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
Takashi Fujimura
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
Takashi Fujimura