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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2008239829
Kind Code:
A
Abstract:

To provide a curable resin composition excellent in handleability because of its low viscosity and pseudoplasticity and good storage stability, high in the strengths of the cured film, and suitable for adhesives for panels and the like.

The curable resin composition contains a polymer having a moisture-curable silicone group, such as a silicone resin and a modified silicone resin, and bentonite treated with an organizing agent. The manufacturing method of the curable resin composition comprises mixing the polymer having the moisture-curable silicone group and the bentonite by using a homogenizer.


Inventors:
YAMADA SHINICHI
Application Number:
JP2007083159A
Publication Date:
October 09, 2008
Filing Date:
March 28, 2007
Export Citation:
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Assignee:
AICA KOGYO CO LTD
International Classes:
C08L101/10; C08K3/34