Title:
WATER-BASED HEAT-CURABLE COMPOSITION
Document Type and Number:
Japanese Patent JP2008239828
Kind Code:
A
Abstract:
To provide a water-based heat-curable composition which, although it is water-based and does not contain formaldehyde, gives by heating a cured product having physical properties equal or superior to the conventional formaldehyde resin.
The water-based heat-curable composition contains a carboxy group-containing polymer obtained by polymerizing a monomer composed mainly of acrylic acid, an alkanol amine such as triethanol amine and a carbodiimide group-containing polymer. The cured product obtained by heating/curing this has the physical properties equal or superior to those of the conventional formaldehyde resin.
Inventors:
MOTOKI RYOTA
HIGASHIMATSU SHINYA
SATO KATSUNAO
HIGASHIMATSU SHINYA
SATO KATSUNAO
Application Number:
JP2007083152A
Publication Date:
October 09, 2008
Filing Date:
March 28, 2007
Export Citation:
Assignee:
AICA KOGYO CO LTD
International Classes:
C08L101/08; C08K5/17; C08L101/02
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