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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION AND LAMINATE
Document Type and Number:
Japanese Patent JP2012001578
Kind Code:
A
Abstract:

To provide a curable resin composition which is superior in adhesion to various base materials such as metals and metal oxides, curable with an active energy ray, and excellent also in adhesion to a polyfunctional (meth)acrylate-based curable resin composition forming a top coat even after curing, and a laminate in which the curable resin composition is applied to a base material.

The curable resin composition contains a benzyl group-containing (meth)acrylate oligomer (A) and a methacrylate compound (B) having 2 or 3 methacryloyl groups. The laminate is obtained by applying the curable resin composition to a base material, curing by irradiation with an active energy ray, further applying another curable resin composition to the resulting resin cured product layer, and curing by irradiation with an active energy ray.


Inventors:
KUMAGAI MASAAKI
Application Number:
JP2010135710A
Publication Date:
January 05, 2012
Filing Date:
June 15, 2010
Export Citation:
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Assignee:
AICA KOGYO CO LTD
International Classes:
C08F290/06; C09D4/02; C09D5/00; C09D7/12; C09D133/04