To provide a curable resin composition for a resist having preferable photosensitivity, alkali-developable property, excellent flame retardant property and flexibility and particularly suitable as a cover lay, solder resist or the like for an FPC.
The curable resin composition for a resist is prepared by compounding a curable resin material for a resist essentially comprising a curable prepolymer (for example, a photo-curable resin material comprising a photosensitive prepolymer having ethylenic unsaturated end groups derived from acrylic monomers, a compound having ethylenic unsaturated groups and a photopolymerization initiator) and a hydrated metal compound surface treated with a surface treating agent (particularly an amphiphilic agent or an agent having polarity such as a silane coupling agent).
KOGURE EIKICHI
YAMADA KENICHI
HIRATA MOTOYUKI
