半導体パッケージ用硬化性樹脂組成物

Title:

半導体パッケージ用硬化性樹脂組成物

Document Type and Number:

Japanese Patent JP5931999

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a curable resin composition for semiconductor packages which is good in moldability, including transfer moldability, and high in light and heat resistances.SOLUTION: A curable resin composition for semiconductor packages contains, as essential components, a polyhedral polysiloxane modified product (A) obtained by modifying a polyhedral polysiloxane-based compound (a) containing alkenyl and/or hydrosilyl groups with a compound (b) having a hydrosilyl group and/or an alkenyl group capable of undergoing a hydrosilylation reaction with the component (a).

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Inventors:

Manabe Takao

Application Number:

JP2014233480A

Publication Date:

June 08, 2016

Filing Date:

November 18, 2014

Export Citation:

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Assignee:

Kaneka Corporation

International Classes:

C08G77/44; C08L83/10; C08G77/50; C08K3/00; C08K3/22; C08K3/36; C08L83/14; H01L23/02; H01L23/08; H01L33/60

Domestic Patent References:

JP2009173759A
JP2009298930A
JP2000265065A

Foreign References:

WO2008133138A1

Attorney, Agent or Firm:

Atomi International Patent Office

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