Title:
CURING BOARD FOR SHIPLAP JOINT FLOOR
Document Type and Number:
Japanese Patent JP2004332508
Kind Code:
A
Abstract:
To solve such a problem of conventional curing boards for floors that as they are insistently used for temporary installation, they have to be removed when carrying-in works or erection works are completed and hence weak adhesive releasable tape (curing tape) is used for fixing joints but it is possible that the tape releases naturally during the work, fine pieces such as wooden chips or plaster board powder intrude into joints during the works and cause defects.
The present curing board prevents fine pieces such as wooden chips or plaster board powder from intruding even when a tape peels naturally and has a sufficient buffering function. Therefore, a shiplap joint processing is applied in the longitudinal end of a curing board.
Inventors:
FUJIMOTO MASAAKI
Application Number:
JP2003162982A
Publication Date:
November 25, 2004
Filing Date:
May 01, 2003
Export Citation:
Assignee:
MF KK
International Classes:
B27M3/04; E04B1/98; E04G21/30; (IPC1-7): E04G21/30; B27M3/04; E04B1/98