Title:
CURRENT SENSOR DEVICE
Document Type and Number:
Japanese Patent JP2018068096
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a current sensor device which achieves excellent assemblability to a plate-like terminal in a semiconductor device.SOLUTION: A current sensor device 30 includes: a bus bar 31; a sensor chip 330 formed with a magnetoelectric transducer which detects electric current flowing through the bus bar; and a resin part 32 which integrally holds the bus bar and the sensor chip. The bus bar is connected with a main terminal 25 in a thickness direction of the main terminal of a semiconductor device 21. The bus bar has a cutout 313, which is partitioned by a wall surface 315 and formed as a penetration part penetrating through the bus bar in a plate thickness direction, at one end 310 protruding from the resin part. The bus bar has a first wall surface 315a and a second wall surface 315b facing each other as wall surfaces. At least one of the first wall surface and the second wall surface is connected with a terminal.SELECTED DRAWING: Figure 2
Inventors:
NOMURA KOSUKE
SAKAI RYOSUKE
ESAKA TAKUMA
SUGITO TATSUAKI
SAKAI RYOSUKE
ESAKA TAKUMA
SUGITO TATSUAKI
Application Number:
JP2017042063A
Publication Date:
April 26, 2018
Filing Date:
March 06, 2017
Export Citation:
Assignee:
DENSO CORP
International Classes:
H02M7/48
Domestic Patent References:
| JP2015033201A | 2015-02-16 | |||
| JP2011172469A | 2011-09-01 | |||
| JP2011010496A | 2011-01-13 | |||
| JP2011114966A | 2011-06-09 | |||
| JP2000209739A | 2000-07-28 | |||
| JPH04109579A | 1992-04-10 |
Foreign References:
| WO2015087433A1 | 2015-06-18 |
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe
Takanori Kubo
Taihei Nonobe
Takanori Kubo
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