Title:
CURVED SURFACE FORMING AND POLISHING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JPH09168967
Kind Code:
A
Abstract:
To provide a curved surface forming and polishing device capable of polishing an object to be polished such as a wafer at high precision and at high speed, and making it flat.
A polishing plate 2 is rotated by a spindle motor 3 at high speed such as at 1500rpm. A wafer 9 held to a wafer sucking film 12 is rotated at 50rpm. The front surface of the wafer 9 is polished by an abrasive pad 1 while making a slider 6 traverse along a rail 26 at the specified amplitude and speed.
Inventors:
SATO SHUZO
SUZUKI TAKASHI
KOMURO YOSHIAKI
SUZUKI TAKASHI
KOMURO YOSHIAKI
Application Number:
JP33167595A
Publication Date:
June 30, 1997
Filing Date:
December 20, 1995
Export Citation:
Assignee:
SONY CORP
International Classes:
B24B7/22; B24B37/00; B24B37/10; H01L21/304; (IPC1-7): B24B37/00; B24B7/22; H01L21/304
Attorney, Agent or Firm:
Takahisa Sato
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