Title:
CUT AND COVER TUNNELING METHOD FOR INSTALLING SEWER AND CUT AND COVER DEVICE FOR INSTALLING SEWER
Document Type and Number:
Japanese Patent JP3703820
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a cut and cover tunneling method for installing a sewer and a cut and cover device for installing the sewer capable of automating the cut and cover of a cut and cover ditch.
SOLUTION: A light-emitting instrument 21 is mounted in a manhole 1 installed in a manhole mounting hole M. The light-emitting instrument 21 irradiates light beams 20 so as to coincide with the axial center of the sewer 2 towards the laying predetermined direction and grade of the sewer 2 connected to a drain inlet 17 or an inflow port 18 for the manhole 1 from the drain inlet 17 or the inflow port 18. The cut and cover ditch 25 in which the sewer 2 is laid is cut and covered by an excavator 5 having an automatic control means P. The set depth of the automatic control means P is corrected and the cut and cover device is controlled automatically, using the light beams 20 received by a light-receiving section 38 secured to a bucket 26 as a reference while the excavator 5 automatically controls and conducts cut and cover works by the bucket 26 or the like up to a previously input set depth by the automatic control means P.
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Inventors:
Chiju Shigeno
Application Number:
JP2003298860A
Publication Date:
October 05, 2005
Filing Date:
August 22, 2003
Export Citation:
Assignee:
Limited company Shigeno
International Classes:
E02F3/43; E03F3/06; F16L1/00; (IPC1-7): E03F3/06; E02F3/43; F16L1/00
Attorney, Agent or Firm:
Junichiro Shinseki
Chiaki Shinseki
Chiaki Shinseki
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