To provide a cutting device and a cutting method, which can cut a molded article after a chip is resin-sealed and can remove a resin flashes and metal burrs in the same process.

The cutting device is provided with a rotating table 1, an adhesive tape 2 bonded onto the rotating table 1 and a blade 11 and a rotary grind stone 12, which are fitted to rotary shafts 9 and 10. The rotary grind atone 12 is fitted, so that a peripheral face is brought into contact with the non-sealing face of a lead frame 4 including two edge lines in an opening 13, formed by cutting immodiately after the blade 11 cuts the molded article 3. The blade 11 cuts the molded article 3 fixed to the rotating table 1 by the adhesive tape 2, and the rotary grind stone 12 polishes the non-sealing face. Thus, the rotary grind stone 12 polishes and removes resin flash 6 and the metal burrs generated at cutting. Consequently, the resin flash 6 and the metal burrs can be removed in the same process as cutting, without having to install the removing process of the burrs.