To suppress occurrence of wafer cut defects to a minimum level.

A device is provided with a chuck table 10, on which a wafer is loaded so that the surface of the wafer faces downward and in which a hole 16 in a prescribed size is formed in a center part; a camera 20 which is arranged in the hole 16 of the chuck table 10 and which recognizes the form of a semiconductor chip on the surface of the wafer exposed through the hole 16; a cutting blade 30 cutting the reverse face of the wafer loaded on the chuck table 10 and a control part 40, which is electrically connected to the chuck table 10, the camera 20 and the cutting blade 30 and controls the driving of the chuck table 10, the camera 20 and the cutting blade 30. The control part 40 drives the chuck table 10, in matching with the information about the wafer that the camera 20 recognizes, arranges the position of the wafer by adjusting it to the cutting blade 30, drives the cutting blade 30 and cuts the wafer.