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Patent Searching and Data


Title:
CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2002001689
Kind Code:
A
Abstract:

To provide a cutting device capable of easily and properly adjusting a cutting state of a wrapping film.

A pair of cutting bodies 71c, 72b provided free to cut a wrapping film 2 by holding and pressurizing it, a pressurizing means 73 capable of giving holding pressure by pressurizing at least one of the cutting bodies 71c, 72b, an adjusting means 74 free to adjust pressurizing force of the pressurizing means 73 and a display part 75 free to display value of the pressurizing force are provided.


More Like This:
JPS62208894ROTARY CUTTER
JPH09323292SHEET MATERIAL CUTTER
Inventors:
SAKAI KOSUKE
Application Number:
JP2000189711A
Publication Date:
January 08, 2002
Filing Date:
June 20, 2000
Export Citation:
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Assignee:
NIPPON SEIKI CO LTD
International Classes:
B26D1/38; (IPC1-7): B26D1/38
Domestic Patent References:
JPH0320229A1991-01-29
JPH0631684A1994-02-08
JPH11180402A1999-07-06
JPH06155380A1994-06-03