Title:
CUTTING METHOD AND DEVICE FOR SEMICONDUCTOR WAFER PROTECTIVE FILM
Document Type and Number:
Japanese Patent JP3919292
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method and device for cutting a protective film exactly according to the shape of a semiconductor wafer.
SOLUTION: After a protective film 109 is stuck on the surface of a semiconductor wafer W, the protective film 109 is cut with a cutter blade 301a according to the shape of the semiconductor wafer W. The cutter blade 301a is moved in Ydirection to cut a section from the corner C1 to a corner C2 of an orientation flat. A cutter 301 and a table 201 are moved and the table 201 is rotated to meet the cutter blade 301a in the tangential direction of the circumferential part of the semiconductor wafer W and the cutting direction of the cutter blade 301a. The table 201 is rotated to cut the protective film 109 along the circumferential part.
Inventors:
Hiroshi Saito
Tsuyoshi Kurita
Koji Okamoto
Tsuyoshi Kurita
Koji Okamoto
Application Number:
JP15783197A
Publication Date:
May 23, 2007
Filing Date:
May 30, 1997
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
B26D3/10; (IPC1-7): B26D3/10
Domestic Patent References:
| JP61276231A | ||||
| JP4135198A | ||||
| JP62236738A |
Attorney, Agent or Firm:
Takashi Matsuura
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