Title:
CUTTING METHOD FOR SLICING MACHINE
Document Type and Number:
Japanese Patent JPH04216011
Kind Code:
A
Abstract:
PURPOSE: To process a wafer in a desired shape.
CONSTITUTION: Blade sensors 30, 30 and press pads 28, 28 and 29, 29 are installed. The working positions of press pads are changed based on the sensed values of blade sensors 30, 30 to control the shape of the curved faces of blades. The control of blades in the direction Y-Y can be controlled by said arrangement.
Inventors:
IIDA MASAYOSHI
Application Number:
JP40202590A
Publication Date:
August 06, 1992
Filing Date:
December 13, 1990
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
B24B27/06; B23D59/00; B28D5/00; B28D5/02; H01L21/304; (IPC1-7): B24B27/06; B28D1/22; H01L21/304
Attorney, Agent or Firm:
Kenzo Matsuura