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Title:
CUTTING METHOD OF WORK TO BE MACHINED AND ITS DEVICE
Document Type and Number:
Japanese Patent JPH0386423
Kind Code:
A
Abstract:

PURPOSE: To restrain the generation of cutting heat with good efficiency by cutting a work by a mechanical means with the work immersed in machining liquid.

CONSTITUTION: A cutter mounting frame 6 is made to go straight and reciprocate in approximate parallel to liquid level 1a along guide rails 7, 7. On the other hand, a work 3 which is positioned and fixed on a work positioning base 4 installed on the bottom of a liquid tank 2 is pressed up, and it is made to come into contact with a cutter 5 installed on the cutting edge mounting frame at a fixed pressure to cut the work 3 by the cutter 5 during reciprocating and straight movements. It is thus possible to restrain the generation of cutting heat with good efficiency by cutting the work 3 to be machined in machining liquid 1 and discharge cutting chips generated while cutting the work 3 wit good efficiency.


Inventors:
KURODA SHINICHI
SAITO SHOSHICHI
SUEYOSHI MASANORI
OIKE HIDESHI
TAMURA HISAYA
SUZUKI KAZUAKI
Application Number:
JP21852089A
Publication Date:
April 11, 1991
Filing Date:
August 28, 1989
Export Citation:
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Assignee:
SONY CHEMICALS
International Classes:
B23D51/00; B23D59/04; (IPC1-7): B23D51/00; B23D59/04
Attorney, Agent or Firm:
Akira Koike (2 outside)



 
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