Title:
CUTTING PATH EVALUATION DEVICE, CUTTING PATH GENERATION DEVICE, AND PROGRAM
Document Type and Number:
Japanese Patent JP2023020771
Kind Code:
A
Abstract:
To provide a device which can evaluate and generate a cutting path that suppresses a maximum value and fluctuation of a processing load. when cutting a work-piece, and suppresses deformation of the work-piece and tool life reduction.SOLUTION: A cutting path evaluation device for evaluating a cutting path by a cutting tool comprises a relative angle evaluation part 111. The relative angle evaluation part 111 acquires an inclination angle of a blade of the cutting tool used in the cutting path of an evaluation object (1), acquires an inclination angle of a processed surface of a work-piece which becomes a cutting object in the cutting path (2), calculates a relative angle between the blade of the cutting tool and the processed surface of the work-piece (3), and evaluates a magnitude of the relative angle, and determines whether the cutting path of the evaluation object can be adopted (4).SELECTED DRAWING: Figure 1
Inventors:
YAMADA YU
IWAMURO MASAHARU
KAMISHIRO YOSHITAKA
ESUMI MASAKUNI
MIYAUCHI MOTOHARU
FUJII MASAHIRO
IWAMURO MASAHARU
KAMISHIRO YOSHITAKA
ESUMI MASAKUNI
MIYAUCHI MOTOHARU
FUJII MASAHIRO
Application Number:
JP2021126336A
Publication Date:
February 09, 2023
Filing Date:
July 30, 2021
Export Citation:
Assignee:
HITACHI LTD
International Classes:
B23Q15/00; B23C1/12; B23C5/10; B23C9/00; G05B19/4093
Attorney, Agent or Firm:
Seiryo Patent Attorneys Corporation