To provide a cutting plotter for facilitating cleaning work during the replacement of a processed medium in a short time, and improving work efficiency for a cutting process.

The cutting plotter 1 includes a planar plate-shaped vacuum table 12a where a medium 2 is placed to be held, a processing device 61 cutting the medium 2 while moving relatively to the medium 2, a suction duct 65 sucking and removing chips generated when the processing device 61 cuts the medium 2 while moving relatively to the medium 2, and a controller 23 setting a relative movement range where the suction duct 65 relatively moves above the vacuum table 12a for sucking and removing the chips on the upper surface of the vacuum table 12a while the suction duct 65 moves relatively to the vacuum table 12a after the medium 2 cut by the process device 61 is removed from the vacuum table 12a.