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Title:
CUTTING TOOL
Document Type and Number:
Japanese Patent JP2011110653
Kind Code:
A
Abstract:

To provide a cutting tool capable of restraining sudden chipping and separation of a coating layer in a cutting edge.

In this cutting tool such as a throwaway tip 1, a surface of a base body 2 is coated with a coating layer 9 composed of nitride or carbonitride including Ti and Al, and a half value width (d) of the (200) surface peak of the coating layer in very small part X-ray diffraction measurement of a Cu-Kα ray is minimum (db<da, dc) in the cutting edge 8 with a crossing ridgeline part of a rake surface 3 and a flank 4 as the cutting edge 8. The half value width (d) of the (200) surface peak of the coating layer 9 desirably becomes large toward a surface of the coating layer 9 from just above the base body 2 (db/db'>1). Here, in a diffraction pattern (an XRD pattern) by the very small X-ray diffraction measurement of the Cu-Kα ray, assuming the half value width of the (200) surface peak of the coating layer 9 in (a) the rake surface, (b) the cutting edge and (c) the flank as da, db and dc, the half value width in an intermediate thickness of the coating layer 9 is set to db'.


Inventors:
MATSUZAWA MASATO
Application Number:
JP2009269515A
Publication Date:
June 09, 2011
Filing Date:
November 27, 2009
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
B23B27/14; B23C5/16
Domestic Patent References:
JP2009178774A2009-08-13
JP2003127003A2003-05-08
JP2008238314A2008-10-09
Foreign References:
US7927663B22011-04-19



 
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