Title:
半導体基板の限界寸法測定のための深層学習ベースの適応関心領域
Document Type and Number:
Japanese Patent JP7284813
Kind Code:
B2
Abstract:
A metrology system is disclosed. In one embodiment, the system includes a characterization sub-system configured to acquire one or more images of a specimen. In another embodiment, the system includes a controller configured to: receive one or more training images of a specimen from the characterization sub-system; receive one or more training region-of-interest (ROI) selections within the one or more training images; generate a machine learning classifier based on the one or more training images and the one or more training ROI selections; receive one or more product images of a specimen from the characterization sub-system; generate one or more classified regions of interest with the machine learning classifier; and determine one or more measurements of the specimen within the one or more classified regions of interest.
Inventors:
Yati Alpit
Application Number:
JP2021519555A
Publication Date:
May 31, 2023
Filing Date:
October 01, 2019
Export Citation:
Assignee:
KLA Corporation
International Classes:
H01L21/66; G01B11/14; G01B15/00; G06T7/00; G06V10/75; G06V10/764
Domestic Patent References:
| JP2017529684A | ||||
| JP2010129599A |
Foreign References:
| US20160372303 | ||||
| US20170200264 |
Attorney, Agent or Firm:
Patent Attorney Corporation YKI International Patent Office