Title:
不良検出装置及び不良検出方法
Document Type and Number:
Japanese Patent JP7340302
Kind Code:
B2
Abstract:
A defect detection device (100) which detects a defect in a semiconductor device (10) and is equipped with a standing wave producer (20) for applying an attractive force to a wire (13) by applying a standing wave (30) to the semiconductor device (10), cameras (41, 42), and a control unit (50) for detecting a defect in the semiconductor device (10) and adjusting operation of the standing wave producer (20), wherein the control unit (50) detects a defect in the semiconductor device (10) by capturing, by using the cameras (41, 42), a first image of the semiconductor device (10) in a first state in which the attractive force is applied to the wire (13), and a second image of the semiconductor device (10) in a second state in which the attractive force which is applied to the wire (13) is smaller than when in the first state, and comparing the first and second images.
Inventors:
Munakata Hiroshi
Takuya Adachi
Takuya Adachi
Application Number:
JP2022567047A
Publication Date:
September 07, 2023
Filing Date:
May 10, 2021
Export Citation:
Assignee:
Yamaha Robotics Holdings Co., Ltd.
International Classes:
H01L21/60; G01N29/34; G01R31/26
Domestic Patent References:
| JP55128840A | ||||
| JP2016127085A | ||||
| JP2020027910A |
Foreign References:
| WO2020184644A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation YKI International Patent Office