Title:
蒸着マスク、フレーム付き蒸着マスク、蒸着マスクの製造方法、有機半導体素子の製造方法、及びパターンの形成方法
Document Type and Number:
Japanese Patent JP7191060
Kind Code:
B2
Abstract:
To provide: an evaporation mask capable of accurately confirming whether or not the shape pattern of an opening formed in a resin mask is normal, while satisfying both high-definition and weight saving; an evaporation mask preparation body for acquiring that evaporation mask; a framed evaporation mask having that evaporation mask; and an organic semiconductor element manufacturing method using that framed evaporation mask.SOLUTION: An evaporation mask 100 comprises: a metal mask 10 having a slit 15 formed therein; and a resin mask 20 having an opening 25 formed to correspond to a pattern evaporated at a position to overlap said slit and laminated over the metal mask 10, wherein there is used a resin mask having a light transmittance of 40% or less for a wave length of 550 nm.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
Toshihiko Takeda
Hiroshi Kawasaki
Katsuya Obata
Hiroshi Kawasaki
Katsuya Obata
Application Number:
JP2020054649A
Publication Date:
December 16, 2022
Filing Date:
March 25, 2020
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
C23C14/04; H01L51/50; H05B33/10
Domestic Patent References:
| JP5288072B2 | ||||
| JP2007093431A | ||||
| JP2006292862A |
Attorney, Agent or Firm:
Patent Attorney Corporation Intect International Patent Office
Yoshinori Ishibashi
Yoshinori Ishibashi