DETECTING METHOD FOR POSITION OF PAD ON CHIP

Japanese Patent JP3781508

B2

PROBLEM TO BE SOLVED: To provide a detecting method for the position of a pad on a chip, in which the position of the pad on the chip as the bonding position of a wire can be found precisely, before a wire bonding operation in which the pad on the chip and an electrode on a substrate are connected by the wire. SOLUTION: A first longitudinally long frame A which crosses a pad 12 in the X-direction and a second transversely long frame B which crosses the pad in the Y-direction are set inside the search area S of an image which is fetched by a camera. The first frame A is moved in the X-direction, the second frame B is moved in the Y-direction, and edges E1 to E4 as distributions of the ratio of a bright part to a dark part are found. The middle point between the edge E1 and the edge E2 becomes the X-coordinate position of the pad 12, and the middle point between the edge E3 and the edge E4 becomes the Y-coordinate position of the pad 12.