To prevent the generation of chips associated with cutting when cutting a silicon ingot.

A cutting device cuts a part which is not used as a product from a silicon ingot 5 as a cut-off part 24 and obtains a product block 23 which is used as the product. The cutting device includes first holding means 16 for holding the product block 23 and second holding means 17 for holding the cut-off part 24. The cutting device includes a band saw 12 for cutting the silicon ingot 5 while the product block 23 is held by the first holding means 16 and the cut-off part 24 is held by the second holding means 17. The cutting can be performed while the product block 23 and the cut-off part 24 are held by the first and second holding means 16 and 17 when the silicon ingot 5 is cut into the product block 23 and the cut-off part 24, so that the generation of chips in the vicinity of a cutting surface caused by the self-weight of the cut-off part 24 cut off of the product block 23 can be prevented.