Title:
POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/044735
Kind Code:
A1
Abstract:
The present invention relates to a polishing device for forming a recess in a peripheral section of a bonded wafer or other substrate, with the recess having an orthogonal cross-sectional shape. The polishing device comprises a polishing head (8) having a pressing member (5) for pressing a polishing tape (T) onto a peripheral section of a substrate (W) which is on a substrate holding plane (1a). The pressing member (5) includes: a pressing surface (5A) that is parallel to the substrate holding plane (1a); and an inclined surface (5B) that is connected to the inner edge of the pressing surface (5A), with the angle formed by the pressing surface (5A) and the inclined surface (5B) being an acute angle. The polishing head (8) comprises a positioning roller (33) that determines the relative position of the polishing tape (T) in relation to the inclined surface (5B). An angle of the polishing tape (T) that extends between the positioning roller (33) and the pressing member (5) is an acute angle relative to the pressing surface (5A).
Inventors:
KODERA KENJI (JP)
ITO KENYA (JP)
YAMANOBE HOKUTO (JP)
HARADA MINORU (JP)
ITO KENYA (JP)
YAMANOBE HOKUTO (JP)
HARADA MINORU (JP)
Application Number:
PCT/JP2020/027235
Publication Date:
March 11, 2021
Filing Date:
July 13, 2020
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B21/00; B24B9/00; B24B21/08; H01L21/304
Foreign References:
| US6641464B1 | 2003-11-04 | |||
| JP2016219850A | 2016-12-22 | |||
| JP2015074071A | 2015-04-20 | |||
| JP2001239445A | 2001-09-04 | |||
| JP2008306180A | 2008-12-18 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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