Title:
DEVICE FOR ELECTRON BEAM SURFACE TREATMENT, AND METHOD OF ELECTRON BEAM SURFACE TREATMENT
Document Type and Number:
Japanese Patent JP2014210292
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a device for electron beam surface treatment that can suppress molten metal flow in a fused region on a surface of a workpiece and finish the workpiece with fine surface roughness.SOLUTION: A workpiece W is placed on an XYZ table 4 disposed in a vacuum chamber 2 and configured to move in XYZ directions. A control device 7 and a deflection control device 11 control a convergent lens 9 and a deflection lens 10 so that a surface of the workpiece W is irradiated with an electron beam emitted from an electron gun 8 through the convergent lens 9 and the deflection lens 10, and the electron beam is advanced on a line while locally drawing a circular trajectory with respect to an advancing direction of the electron beam, and is scanned in a target region to be treated of the workpiece W.
Inventors:
MONOTANE TAKESHI
TAKENO YOSHIMIZU
HANAI MASAHIRO
TAKENO YOSHIMIZU
HANAI MASAHIRO
Application Number:
JP2014167163A
Publication Date:
November 13, 2014
Filing Date:
August 20, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K15/00; B23K15/02
Domestic Patent References:
| JPH09216075A | 1997-08-19 | |||
| JPH05261565A | 1993-10-12 | |||
| JPS62214142A | 1987-09-19 | |||
| JPS54142147A | 1979-11-06 |
Attorney, Agent or Firm:
Masuo Oiwa
Takenaka 岑 student
Keigo Murakami
Kenji Yoshizawa
Takenaka 岑 student
Keigo Murakami
Kenji Yoshizawa
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