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Title:
DEVICE AND METHOD FOR APPLYING MOLD WASH MATERIAL
Document Type and Number:
Japanese Patent JP2011235313
Kind Code:
A
Abstract:

To provide a device for applying a mold wash material, which prevents deflection caused in an introducing member for introducing a mold wash material to an injection member and effectively applies the mold wash material to an inner surface of dies, and to provide a method for applying a mold wash material.

The device 10 for applying a mold wash material, includes: an applicator body 16 in which the mold wash material T is stored; the introducing member 18 that is extended from the applicator body in one direction and through which the mold wash material is introduced; the injection member 22 that is provided in a tip end of the introducing member and injects the mold wash material introduced from the introducing member to the inner surface of the cylindrical die 12 being revolved; and a supporting mechanism 24 provided in the introducing member. The introducing member supports the introducing member while coming into contact with the inner surface of the die when applying the mold wash material to the inner surface of the die.


Inventors:
CHIBA HIROYUKI
UCHINAKA YUSUKE
AKADA KENJI
FUKUMOTO TOMONORI
KODAMA HARUKI
Application Number:
JP2010109085A
Publication Date:
November 24, 2011
Filing Date:
May 11, 2010
Export Citation:
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Assignee:
HONDA MOTOR CO LTD
International Classes:
B22D13/10; B22C23/02
Domestic Patent References:
JPS332012B1
JP116393C
Attorney, Agent or Firm:
Takehiro Chiba
Toshiyuki Miyadera
Shuji Ouchi