To provide Pb-free Zn solder alloy for high temperature, which has a melting point of about 300°C to 400°C suitable for assembly of electronic parts and is excellent in wettability, bondability and reliability and does not contain Pb and includes Zn as a main component.

First Pb-free Zn solder alloy is ternary solder alloy which contains Zn, Al, and Bi as the main components, and contains Al being the second element in an amount of 1.0 to 9.0 mass% and Bi being a third element in an amount of 0.1 to 8.0 mass%. Moreover, second Pb-free Zn solder alloy is quaternary solder alloy which contains Al, Bi and P in Zn as the main component, and contains Al being the second element in an amount of 1.0 to 9.0 mass%, Bi being the third element in an amount of 0.1 to 8.0 mass% and P being the quaternary element in an amount of 0.500 mass% or less.