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Title:
DEVICE AND METHOD FOR GRINDING AND POLISHING
Document Type and Number:
Japanese Patent JPH0740239
Kind Code:
A
Abstract:

PURPOSE: To carry out a grinding polishing process continuously and efficiently by setting three processes consisting of rough cutting grinding process, a finishing grinding process and a lap polishing process as one process continuously.

CONSTITUTION: A first grinding device 11 for rough cutting grinding and a second grinding device 21 for finishing grinding and a lap polishing device 31 for lap finishing are contained in a grinding and polishing device. The grinding and polishing device is provided with a first measuring device 15 for measuring the size of a work piece ground by the first grinding device 11, a second measuring device 25 for measuring the size of a work piece ground by the second grinding device 21, a third measuring device 35 for measuring the size of a work piece lap finished by the lap polishing device 31 and an arithmetic unit 39 for performing operation for grinding quantity by the second grinding device 21 and polishing quantity by the lap polishing device 31.


Inventors:
UJITA MINORU
ISHII OSAMU
Application Number:
JP19134193A
Publication Date:
February 10, 1995
Filing Date:
August 02, 1993
Export Citation:
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Assignee:
SONY CORP
International Classes:
B24B37/04; B24B47/20; B24B49/03; B24B51/00; (IPC1-7): B24B49/03; B24B37/04; B24B47/20; B24B51/00
Domestic Patent References:
JPS61252069A1986-11-10
JPH04240058A1992-08-27
Attorney, Agent or Firm:
Hidekuma Matsukuma