To provide a heating treatment device, with which the temperature of a hot plate can be elevated/lowered at high speed in comparison with a conventional heating treatment device.
Inside a post-exposure baking device 44, a hot plate 70 composed of aluminum nitride improved in heat conductivity and strength is provided and this hot plate 70 is heated by a heater 71 printed on the lower surface thereof. A support 65 composed of PTFE improved in heat insulation supports the entire periphery of the hot plate 70 in tight contact to the hot plate 70. Further, a nozzle 74 is provided inside a heat exchange chamber T formed under the hot plate 70, and when lowering the temperature of the hot plate 70, a gas for cooling is blown to the back of the hot plate 70.
ODA TETSUYA
JPH10284382A | 1998-10-23 | |||
JPH10214767A | 1998-08-11 | |||
JPH08316138A | 1996-11-29 | |||
JPH03131016A | 1991-06-04 |