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Title:
DEVICE AND METHOD FOR HEATING TREATMENT
Document Type and Number:
Japanese Patent JP2001168022
Kind Code:
A
Abstract:

To provide a heating treatment device, with which the temperature of a hot plate can be elevated/lowered at high speed in comparison with a conventional heating treatment device.

Inside a post-exposure baking device 44, a hot plate 70 composed of aluminum nitride improved in heat conductivity and strength is provided and this hot plate 70 is heated by a heater 71 printed on the lower surface thereof. A support 65 composed of PTFE improved in heat insulation supports the entire periphery of the hot plate 70 in tight contact to the hot plate 70. Further, a nozzle 74 is provided inside a heat exchange chamber T formed under the hot plate 70, and when lowering the temperature of the hot plate 70, a gas for cooling is blown to the back of the hot plate 70.


Inventors:
TAGAMI MITSUHIRO
ODA TETSUYA
Application Number:
JP2000291712A
Publication Date:
June 22, 2001
Filing Date:
September 26, 2000
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
F26B3/20; B01J19/00; F26B9/06; F26B23/06; F27D7/06; F27D9/00; G03F7/30; H01L21/027; H05B3/10; H05B3/16; H05B3/20; H05B3/68; (IPC1-7): H01L21/027; B01J19/00; F27D7/06; F27D9/00; G03F7/30; H05B3/10
Domestic Patent References:
JPH10284382A1998-10-23
JPH10214767A1998-08-11
JPH08316138A1996-11-29
JPH03131016A1991-06-04
Attorney, Agent or Firm:
Tetsuo Kanemoto (2 outside)