Title:
DEVICE AND METHOD FOR INSPECTING SHEET HOUSING, AND SHEET HOUSING INSPECTED BY THE INSPECTION METHOD
Document Type and Number:
Japanese Patent JP2007329277
Kind Code:
A
Abstract:
To provide a means being capable of accurately deciding the inspection of the deformation of a sheet housing such as a wafer housing while improving the efficiency of the inspection.
A device for inspecting a sheet housing has stepped guides having an insulating property and supporting sheets at every one. The device has conductive plates 7 having top faces and undersides and being supported by the stepped guides while having a conductivity. The device further has shafts arranged to the top faces and the undersides through openings C respectively and having the conductivity, and contacts 25 being abutted against the conductive plates and having the conductivity.
COPYRIGHT: (C)2008,JPO&INPIT
Inventors:
YOSHINO KATSUHIRO
Application Number:
JP2006158899A
Publication Date:
December 20, 2007
Filing Date:
June 07, 2006
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
MIYAZAKI OKI DENKI KK
MIYAZAKI OKI DENKI KK
International Classes:
H01L21/677
Domestic Patent References:
| JP2004172287A | 2004-06-17 | |||
| JPH05162823A | 1993-06-29 | |||
| JP2001284444A | 2001-10-12 | |||
| JP2004111830A | 2004-04-08 |
Attorney, Agent or Firm:
Takaji Kanakura
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