Title:
DEVICE AND METHOD OF LEAD CUTTING
Document Type and Number:
Japanese Patent JP3481889
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a lead cutting device and a method thereof wherein a solder waste adhered on a punch face is less even when the punch is utilized for a long time and cutting condition of a tip end portion of the outer lead being cut is good.
SOLUTION: A punch 2 has a punching part 2a for cutting a tip end portion of an outer lead 14 and, a product take out notching part 2b installed at an upper part of the punching part 2a. A suspended lead cutting punch is lowered for cutting the suspended lead. The punch 2 is lowered for cutting a tip end portion of the outer lead 14 with the punching part 2a. The punching part 2a goes beyond a cutting face of the outer lead 14 and, the product take out notching part 2b is positioned at the outer lead cutting face and is stopped. Under a condition that the punch 2 is stopped, a semi-conductor device main body 13 being separated from a lead frame 11 by an adsorbing arm 4, and the outer lead 14 are made to pass through inside of the product take out notching part 2b and a space between pads 3, which has a spacing, and the die 1 for taking them out.
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Inventors:
Junji Ikura
Application Number:
JP24222099A
Publication Date:
December 22, 2003
Filing Date:
August 27, 1999
Export Citation:
Assignee:
nec Semiconductors Kyushu Co., Ltd.
International Classes:
B21D28/00; B21D28/34; H01L23/50; (IPC1-7): B21D28/00; B21D28/34; H01L23/50
Domestic Patent References:
| JP1126669A |
Attorney, Agent or Firm:
Masahiko Desk (2 outside)