To easily set a laser output and a focal position to be able to achieve desired machining.
A device for setting a laser beam machining condition comprises: a machining condition setting means capable of designating the focal distance of a laser beam in a predetermined range; a plurality of machining conditions forming means for forming the groups of a plurality of machining conditions in which machining parameters designated using a range by the machining condition setting means are varied within a designated range; a test machining pattern forming means for forming a test machining pattern in which focal distance is varied in accordance with machining position by irradiating a workpiece with the laser beam to cause the workpiece to be machined into a predetermined pattern under each machining condition, and also, by machining the workpiece at a different position for each machining condition, based on a plurality of machining conditions formed by a plurality of machining conditions forming means; and a machining condition selecting means in which, by selecting a desired machining position from the test machining patterns formed by the test machining pattern forming means, a machining condition adopted in the desired machining position is extracted and can be reset as a machining condition.
| JP2003069294 | IC CHIP MOUNTER |
| WO/2013/081247 | METALLIC MICROSTRUCTURE AND METHOD FOR PROCESSING SAME |
| JPS6245492 | APPARATUS FOR COMPENSATING TRACK OF LASER BEAM AND ITS USE |
IDAKA MAMORU
HASEBE HIROYASU
YAMAKAWA HIDEKI
| JPS63113607A | 1988-05-18 | |||
| JPH04300085A | 1992-10-23 | |||
| JPH1128586A | 1999-02-02 | |||
| JP2001328848A | 2001-11-27 | |||
| JP2002239760A | 2002-08-28 | |||
| JP2004298905A | 2004-10-28 | |||
| JP2004358474A | 2004-12-24 |
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