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Title:
DEVICE AND METHOD FOR REDUCED-PRESSURE DRYING AND TRAPPING DEVICE
Document Type and Number:
Japanese Patent JP2005085814
Kind Code:
A
Abstract:

To provide a reduced-pressure drying device which is capable of automatically removing a trapped solvent and operating continuously, to provide a reduced-pressure drying method, and to provide a trapping device which is capable of automatically removing trapped liquid.

A solvent vapor, volatilized from a coating film while a wafer W, is subjected to a reduced pressure drying process is liquified and trapped by a trapping member 31 provided at the middle of the exhaust path 5, then the trapping member 31 is moved to the side of a drainage chamber 32 and then made to pivot so as to shake off the droplets of solvent, and the solvent is discharged out by suction through a suction path 45. These processes are carried out automatically and continuously.


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Inventors:
KOBAYASHI SHINJI
WAKAMOTO YUKIHIRO
SUGIMOTO SHINICHI
Application Number:
JP2003312909A
Publication Date:
March 31, 2005
Filing Date:
September 04, 2003
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
F26B5/04; B01D5/00; F26B21/00; H01L21/304; (IPC1-7): H01L21/304; B01D5/00; F26B5/04; F26B21/00
Attorney, Agent or Firm:
Toshio Inoue
Mizuno Hiromi