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Title:
DEVICE AND METHOD FOR STICKING ADHESIVE FILM
Document Type and Number:
Japanese Patent JP2009147087
Kind Code:
A
Abstract:

To provide a device capable of sticking an adhesive film on a semiconductor wafer, even if the semiconductor wafer is surrounded by a dicing frame.

The device 20 for sticking the adhesive film includes: a stage 22; a ramp 24; a drive section 26; and a laminate roll 28. On the stage 22, a body 10 to be treated is placed. The body 10 to be treated has: a dicing tape 12; a semiconductor wafer 14 where a plurality of bump electrodes 14a are provided on a circuit surface S1 and a back S2 is stuck to the dicing tape 12; and an annular dicing frame 16 stuck to the dicing tape 12 to surround the semiconductor wafer 14. The ramp 24 is connected to the drive section 26 via a drive shaft 26a and raises the semiconductor wafer 14. The laminate roll 28 sticks an adhesive film F onto the circuit surface S1 of the semiconductor wafer 14 while the semiconductor wafer 14 has been raised by the ramp 24.


Inventors:
NAGAI AKIRA
KAWABATA YASUNORI
ENOMOTO TETSUYA
Application Number:
JP2007322435A
Publication Date:
July 02, 2009
Filing Date:
December 13, 2007
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H01L21/301; H01L21/683
Domestic Patent References:
JP2007048920A2007-02-22
JP2006049482A2006-02-16
JP2005159044A2005-06-16
JP2004311603A2004-11-04
JP2008028130A2008-02-07
JP2007311570A2007-11-29
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu



 
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