DEVICE AND METHOD FOR SUBSTRATE TRANSPORTING, TREATMENT DEVICE, AND SUBSTRATE TREATMENT SYSTEM

Japanese Patent JP3530774

B2

PROBLEM TO BE SOLVED: To make a space to be cleaned as small as possible by providing a substrate supporting section which supports substrates, at the same time, supporting a housing box equipped a lid member for putting the substrates in and out of the box on its front face by a moving body which moves in the separating, and contacting direction of a substrate transporting device.
SOLUTION: A lid member is attached to a housing box so as to close the opening of the main body section 51 of the box having the opening on its front face. In the main body section 51, substrate supporting sections 51d and 51e which are composed of projecting strips respectively protruded from side wall sections 51b and 51c are provided at a prescribed distance from the bottom wall section 51a of the main body section 51. The housing box constituted in the abovementioned way is supported by a moving body 45 which moves in the separating and contacting direction of a substrate transporting device 20, and moved to a position near an aimed treating device 60 in the Y-direction by driving the moving body 41. Therefore, a space to be cleaned can be made as small as possible.

JP2001345241	SYSTEM AND METHOD FOR TREATING SUBSTRATE
JPH0964149	SEMICONDUCTOR PRODUCTION DEVICE
JP2004128021	WAFER TRANSFER APPARATUS

Ota, Yoshiharu
Tateyama, Kiyohisa
Araki, Shinichiro
Iwasaki, Tatsuya
Anai, Noriyuki
Iwazu, Haruo

JP18895899A

May 24, 2004

July 02, 1999

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TOKYO ELECTRON LTD

H01L21/677; B65G49/06; H01L21/673; H01L21/68; (IPC1-7): H01L21/68; B65G49/06

大森 純一

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