To provide a device and a method for treating a substrate which keeps temperature or the like of a treatment liquid provided to the substrate at a given level with no increase in an amount of the treatment liquid and reduction of throughput in the treatment.

The device has an arrangement wherein chemicals which have been pumped up from a chemicals tank 23 and of which the temperature has been controlled by a temperature controller 25 are supplied to a treatment liquid supply nozzle 2 through a chemicals supply path 21, a receiving member 3 is disposed for receiving the treatment liquid which is discharged from the nozzle 2, and a chemicals feedback path 33 extending to the chemicals tank 23 is connected to the receiving member 3. Before starting treatment, the chemicals (temperature controlled liquid) are being circulated through a chemicals circulating path consisting of the chemicals tank 23, the chemicals supply path 21, the receiving member 3 and the chemicals feedback path 33. When a wafer W is received by a spin chuck 1, the receiving member 3 is withdrawn to a position for avoiding the treatment liquid to allow the nozzle 2 to supply the temperature controlled liquid to the wafer W.