Title:
DEVICE AND METHOD FOR TREATING SUBSTRATE
Document Type and Number:
Japanese Patent JP3892749
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a device and a method for treating a substrate in which an increase in drying cost can be controlled without generating a water mark.
SOLUTION: When a fluorine based solvent, i.e., HFE (hydrofluoroether), is supplied from a nozzle 50 for ejecting a drying agent while rotating a cleaned substrate W held on a rotor 30, pure water on the substrate W is shaken off by a centrifugal force and the HFE evaporates quickly together with water drops entering a fine pattern formed on the substrate W. Consequently, drying performance can be enhanced while controlling the failure of drying in the fine pattern.
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Inventors:
Masahiro Motomura
Application Number:
JP2002095694A
Publication Date:
March 14, 2007
Filing Date:
March 29, 2002
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
F26B3/04; H01L21/304; F26B5/08; F26B7/00; F26B9/06; F26B21/14; (IPC1-7): H01L21/304; F26B3/04; F26B5/08; F26B7/00; F26B9/06; F26B21/14
Domestic Patent References:
| JP11340187A | ||||
| JP2001250803A | ||||
| JP11330039A | ||||
| JP11026422A | ||||
| JP2002050600A | ||||
| JP2001308059A |
Attorney, Agent or Firm:
Shigeaki Yoshida
Yoshitake Hidetoshi
Takahiro Arita
Yoshitake Hidetoshi
Takahiro Arita
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