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Title:
DEVICE FOR PROCESSING UNDER VACUUM
Document Type and Number:
Japanese Patent JP2003038949
Kind Code:
A
Abstract:

To provide a sputtering device in which an ultimate vacuum is improved.

In the sputtering device, a space surrounded with an O-ring 51, a target 60 and a vacuum tank 2 is made a vacuum atmosphere, and an insulating member 4 is arranged at the outside of the space. The insulating member 4 is not exposed directly to the space surrounded with the O-ring 51, the target 60 and the vacuum tank 2, that is, the inside of the vacuum tank 2. Therefore, release of gases from the insulating member 4 to the inside of the vacuum tank 2 is avoided and the amount of gases discharged into the inside of the vacuum tank 2 is made small even when the insulating member 4 releasing relatively large amount of gases is used. Accordingly, the ultimate vacuum can be improved.


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Inventors:
MORIMOTO NAOKI
KONDO TOMOYASU
NABEYA AKIO
NAKAJIMA KUNIAKI
Application Number:
JP2001229666A
Publication Date:
February 12, 2003
Filing Date:
July 30, 2001
Export Citation:
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Assignee:
ULVAC CORP
International Classes:
B65D81/20; B01J3/03; B65D53/02; C23C14/56; (IPC1-7): B01J3/03; B65D53/02; B65D81/20; C23C14/56
Domestic Patent References:
JPH1072665A1998-03-17
JP2001002114A2001-01-09
JPH0874048A1996-03-19
JP2000173930A2000-06-23
JPH0391237A1991-04-16
Attorney, Agent or Firm:
Shigeo Ishijima (1 outside)



 
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