Title:
Dia touch film
Document Type and Number:
Japanese Patent JP6136268
Kind Code:
B2
Abstract:
Provided are a die attach film, a semiconductor wafer, and a semiconductor packaging method. The die attach film can prevent generation of burrs or scattering of chips in a dicing process, and exhibits excellent expandability and pick-up characteristics in a die pressure-sensitive adhesive process. Further, the die attach film can prevent release, shifting, or deflection of a chip in a wire pressure-sensitive adhesive or molding process. Thus, it is possible to improve embeddability, inhibit warpage of a wafer or wiring substrate, and enhance productivity in a semiconductor packaging process.
Inventors:
Hyo Soo Ju
Suk Ki Chang
Hyo Seung Park
Yong Su Park
John Wang Hong
Hyun Ju Cho
Jang Seung Kim
Suk Ki Chang
Hyo Seung Park
Yong Su Park
John Wang Hong
Hyun Ju Cho
Jang Seung Kim
Application Number:
JP2012534084A
Publication Date:
May 31, 2017
Filing Date:
October 16, 2009
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
H01L21/52; C09J7/20; C09J109/02; C09J123/00; C09J127/06; C09J133/00; C09J161/00; C09J163/00; C09J171/12; C09J177/00; C09J179/08; C09J181/06; C09J201/00; H01L21/301
Domestic Patent References:
| JP200435841A |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe