Title:
DICING ABNORMALITY SENSING DEVICE
Document Type and Number:
Japanese Patent JPH05220733
Kind Code:
A
Abstract:
PURPOSE: To provide a dicing abnormality sensing device for sensing the abnormalities such as bending of a diamond blade or the like, eliminating defective semi-conductor wafers at the time of cutting and improving the working efficiency of the device.
CONSTITUTION: A device consists of a luminous diode(LD) 18 for emitting beam to a cutter blade 14 of a dicing device, a focusing diode(FD) 19 for sensing the reflection beam from the cutter blade 14 and a sensing circuit 20 for sensing the abnormality of the cutter blade 14 by the output variation of the focusing diode 19.
Inventors:
INOUE YUKIHISA
Application Number:
JP2962592A
Publication Date:
August 31, 1993
Filing Date:
February 17, 1992
Export Citation:
Assignee:
YOKOGAWA ELECTRIC CORP
International Classes:
B24B27/06; B23D59/00; B24B49/12; B28D5/00; H01L21/301; (IPC1-7): B24B27/06; B24B49/12; B28D5/00; H01L21/78
Attorney, Agent or Firm:
Shinsuke Ozawa