PURPOSE: To provide a dicing blade wherein its cutting capability is not lowered, it can remove cuttings or the like sufficiently and it does not lower the quality of a semiconductor element chip when the semiconductor element chip is cut off from a wafer.

CONSTITUTION: Blade grooves 24 are formed at a prescribed pitch on both faces of a cutting blade 23 formed in a ring shape at the outer circumferential part of a dicing blade 20 toward its radial direction and in its peripheral direction. Pure water for cooling and cleaning creeps sufficiently to a cutting part via the blade grooves 24, the cutting blade 23 is cooled sufficiently, and cuttings or the like can be removed sufficiently from the cutting part.