Title:
DICING METHOD AND DICING DEVICE
Document Type and Number:
Japanese Patent JP2014044987
Kind Code:
A
Abstract:
To facilitate removing a chip piece, which is generated by rear face chipping, by using a dicing blade, in relation to a dicing method and a dicing device.
A dicing tape is irradiated with ultraviolet rays along a scribing line before dicing, and thereby an ultraviolet ray curable adhesive paste layer in linear regions of two lines in parallel with each other along the scribing line is cured.
Inventors:
NAKAZATO YASUSHI
SHINJO YOSHIAKI
TAZAWA MASAYA
SHINJO YOSHIAKI
TAZAWA MASAYA
Application Number:
JP2012185049A
Publication Date:
March 13, 2014
Filing Date:
August 24, 2012
Export Citation:
Assignee:
FUJITSU SEMICONDUCTOR LTD
International Classes:
H01L21/301
Domestic Patent References:
| JPH0917752A | 1997-01-17 | |||
| JP2011067873A | 2011-04-07 | |||
| JPH08274048A | 1996-10-18 |
Foreign References:
| WO2009047990A1 | 2009-04-16 |
Attorney, Agent or Firm:
Kenji Doi
Hayashi Tsunetoku
Manabe Kiyoshi
Shoji Kashiwaya
Hayashi Tsunetoku
Manabe Kiyoshi
Shoji Kashiwaya
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