Title:
DIE BONDER APPARATUS
Document Type and Number:
Japanese Patent JPH05121470
Kind Code:
A
Abstract:
PURPOSE: To provide a die bonder apparatus wherein its maintenance control is made easy by improving the wear-resistant property of a collet holder, it is made lightweight and it can cope with the high speed of a die chucking operation and a die bonding operation.
CONSTITUTION: In a die bonder apparatus, an operation in which a semiconductor pellet 1 is held by air-suction by the tip of die collets 4, 6 held by a collet holder 11a and an operation in which the semiconductor pellet 1 held is transferred and pressed to the surface of a lead frame 5 are repeated, and the semiconductor pellet 1 is bonded continuously to the lead frame 5. In the die bonder apparatus,, the collet holder 11a is made of a ceramic material.
More Like This:
| JP7071433 | Ejector device |
| JP2001071126 | SOLDER DEAERATING DEVICE AND DIE BONDING DEVICE |
| JP2510585 | [Name of device] Package for storing semiconductor elements |
Inventors:
SHIODA TAKESHI
Application Number:
JP28305591A
Publication Date:
May 18, 1993
Filing Date:
October 29, 1991
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L21/52; H01L21/67; H01L21/68; (IPC1-7): H01L21/52; H01L21/68
Attorney, Agent or Firm:
Hisano Hatano (1 person outside)